XG-50 Solder Flux Paste Soldering Tin Cream Welding Fluxes For PCB BGA SMD Phone

Description

XG-50 Solder Flux Paste Soldering Tin Cream Welding Fluxes For PCB BGA SMD Phone
SKU: O710159601430858340
Description:
Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on.
Good soldering and welding tool.
No residual, non-corrosiveness and high insulation.
High adhesive with iron tip.
Application: Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
100% brand new and high quality.
Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on.
Good soldering and welding tool.
No residual, non-corrosiveness and high insulation.
Without poor solder.
High adhesive with iron tip.
Specification:
Material: Plastic+solder paste.
Color: As picture shown.
Size: Approx. 1.30*1.30*1.14inch / 3.3*3.2*2.9cm.
Type: XG-50.
Alloy: Sn63/Pb37.
Microns: 20-38um.
Application: Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
Note:
1.Please allow a little size error due to manual measurement.
2.Please be reminded that due to lighting effects and monitor's brightness/contrast settings etc, the color tone of the website's photo and the actual item could be slightly different.
Package Included:
1× XG-50 Solder Paste.